Supported Technologies

September 24, 2014

  • Component placement of Ball Grid Array (BGA), micro BGA, chip scale package, package-on-package, ultra-fine pitch, and component placement of 01005
  • Maximum PCB Size of 24″ X 24″
  • Single & double-sided SMT reflow
  • Design From Experiment and Design For Manufacturability and Test
    • (DOE, DFM, and DFT)
  • X-ray Inspection and Root Cause Analysis (RCA)
  • AOI (Automated Optical Imaging)
  • Conformal coating and custom potting
  • Large unique component count capabilities
  • New product introduction expertise
  • CSA, UL and CE certified assembler
  • RoHS (lead free) and leaded processes
  • Water soluble and no-clean flux types
  • Certified IPC trainer on staff for J-STD-001
  • Testing options: in circuit, environmental stress, and full function
  • IECEx Certification in process

See all of our Manufacturing Capabilities.