Finished Goods Services

September 24, 2014

Our post production services can save you valuable time, labor, and space.

  • Full custom mechanical assembly
    • Simple PCBA level assembly to full-scale mechanical integration of enclosures and custom packaging
  • Storage of your manufactured products
    • Larger production runs will lower your per unit costs and we will store the finished product
  • Drop shipments
    • We will forward your completed goods directly to your customers


Supported Technologies

September 24, 2014

  • Component placement of Ball Grid Array (BGA), micro BGA, chip scale package, package-on-package, ultra-fine pitch, and component placement of 01005
  • Maximum PCB Size of 24″ X 24″
  • Single & double-sided SMT reflow
  • Design From Experiment and Design For Manufacturability and Test
    • (DOE, DFM, and DFT)
  • X-ray Inspection and Root Cause Analysis (RCA)
  • AOI (Automated Optical Imaging)
  • Conformal coating and custom potting
  • Large unique component count capabilities
  • New product introduction expertise
  • CSA, UL and CE certified assembler
  • RoHS (lead free) and leaded processes
  • Water soluble and no-clean flux types
  • Certified IPC trainer on staff for J-STD-001
  • Testing options: in circuit, environmental stress, and full function
  • IECEx Certification in process

Surface Mount Assembly

September 23, 2014

SMT Lines

  • JUKI KE3010 & KE3020 placement machines
    • Automated solder paste machine
    • PCB size capacity of 24” x 24”
    • Ten-zone convection reflow oven
    • Component placement rate of 37,000 per hour (optimum)
    • Package-on-package placements, Ultra-fine pitch, Micro BGA, and minimum component size placed = 01005 (Imperial Code)
    • BGA rework station capable of repairing/replacing a large assortment of blind components.