Manufacturing Capabilities

As technology evolves, we do too. We manufacture a wide variety of components and products using the latest equipment and up-to-date processes.

We are continually investing in the latest technology and processes to provide a viable “on shore” option.

Component placement of Ball Grid Array (BGA), micro BGA, chip scale package, package-on-package, ultra-fine pitch, and component placement of 01005
Maximum PCB Size of 24″ X 24″
Single & double-sided SMT reflow
Design From Experiment and Design For Manufacturability and Test
- (DOE, DFM, and DFT)
X-ray Inspection and Root Cause Analysis (RCA)
AOI (Automated Optical Imaging)
Conformal coating and custom potting
Large unique component count capabilities
New product introduction expertise
CSA, UL and CE certified assembler
RoHS (lead free) and leaded processes
Water soluble and no-clean flux types
Certified IPC trainer on staff for J-STD-001
Testing options: in circuit, environmental stress, and full function
IECEx Certification in process

Our post production services can save you valuable time, labor, and space.

Full custom mechanical assembly
- Simple PCBA level assembly to full-scale mechanical integration of enclosures and custom packaging
Storage of your manufactured products
- Larger production runs will lower your per unit costs and we will store the finished product
Drop shipments
- We will forward your completed goods directly to your customers